Structure of printed circuit board and carrier and

专利名称：Structure of printed circuit board and carrier

and method of making semiconductorpackage

发明人：CHUNG-PAO WANG申请号：US16224781申请日：20181218

公开号：US20190189467A1公开日：20190620

专利附图：

摘要：A structure of a printed circuit board and a carrier is coupled with a chip, and theprinted circuit board contains: a trace, and a dielectric layer. The carrier includes at least

an element. The trace at least includes a terminal; the trace has an upper surface, a lowersurface, and a side edge, the dielectric layer includes a predetermined opening, an uppersurface, a lower surface, and a side edge, wherein the predetermined opening is formedby a portion of the dielectric layer and corresponds to the terminal of the trace. And thecarrier is coupled with the dielectric layer.

申请人：CHUNG-PAO WANG

地址：Taichung City TW

国籍：TW

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