THERMOELECTRIC MODULES, THERMOELECTRIC ASSEMBLIES,

专利名称：THERMOELECTRIC MODULES,

THERMOELECTRIC ASSEMBLIES, ANDRELATED METHODS

发明人：SMYTHE, Robert, Michael,HERSHBERGER,

Jeffrey, Gerard,HILL, Richard, F.

申请号：EP10806765.3申请日：20100301公开号：EP2462635A1公开日：20120613

摘要：An example thermoelectric module of the present disclosure generally includesa first laminate having a dielectric layer and an electrically conductive layer coupled tothe dielectric layer, a second laminate having a dielectric layer and an electricallyconductive layer coupled to the dielectric layer, and thermoelectric elements disposedgenerally between the first and second laminates. At least one of the dielectric layers is apolymeric dielectric layer. The electrically conductive layer of the first laminate is at leastpartially removed to form electrically conductive pads on the first laminate. The

electrically conductive layer of the second laminate is at least partially removed to formelectrically conductive pads on the second laminate. The thermoelectric elements arecoupled to the electrically conductive pads of the first and second laminates forelectrically coupling the thermoelectric elements together.

申请人：Laird Technologies, Inc.

地址：101 Swingley Ridge Road Chesterfield, MO 63017 US

国籍：US

代理机构：Edlund, Fabian

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