Electrical connector structure of circuit board an

专利名称：Electrical connector structure of circuit

board and method for fabricating the same

发明人：Wen-Hung Hu申请号：US11370532申请日：20060308公开号：US076029B2公开日：20091027

专利附图：

摘要：An electrical connector structure of circuit board and a method for fabricatingthe same are proposed. A circuit board having a conductive layer is formed with a firstresist layer and a second resist layer thereon, so as to form electrical connection padsand metal bumps on the electrical connection pads. The first and second resist layers areformed with openings therein at positions corresponding to the electrical connectionpads and metal bumps, and the exposed conductive layer is removed. An adhesive layer isformed to cover the exposed surfaces of the electrical connection pads and the metalbumps. Then, the second resist layer, the first resist layer and the conductive layercovered by the first resist layer are removed. Later, an insulating protective layer is

formed on a surface of the circuit board, and thinned to expose a portion of the adhesivelayer, such that electrical connectors of the circuit board are fabricated.

申请人：Wen-Hung Hu

地址：Hsin-chu TW

国籍：TW

代理机构：Sawyer Law Group, P.C.

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