专利名称：Circuit structure
发明人：Chia-Chan Chang,Gwo-Chaur Chen,Yung-Tsai
Chen
申请号：US15593322申请日：20170512公开号：US09955578B2公开日：20180424
专利附图：
摘要：A circuit structure includes a patterned circuit layer, a patterned insulating layerand a support plate. The patterned insulating layer covers a portion of the patternedcircuit layer, wherein an upper surface of the patterned circuit layer is aligned with a top
surface of the patterned insulating layer. The support plate is disposed on a bottomsurface of the patterned insulating layer, wherein the support plate, the patternedinsulating layer and the patterned circuit layer define a plurality of air gaps.
申请人：Unimicron Technology Corp.
地址：Taoyuan TW
国籍：TW
代理机构：JCIPRNET
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容
Copyright © 2019- igat.cn 版权所有 赣ICP备2024042791号-1
违法及侵权请联系：TEL:199 1889 7713 E-MAIL:2724546146@qq.com
本站由北京市万商天勤律师事务所王兴未律师提供法律服务