专利名称：Arrangement and method for processing
electrical substrates using lasers
发明人：Sebastien Edme,Stefan Lesjak,Eddy Roelants申请号：US10663916申请日：20030917公开号：US06849823B2公开日：20050201
专利附图：
摘要：For processing electric circuit substrates, a laser source with a diode-pumped.quality-controlled, pulsed solid-state laser is used. The laser is able to emit laserradiation with a wavelength between 266 nm and 1064 nm, a pulse repetition rate
between 1 kHz and 1 MHz and a pulse length of 30 ns to 200 ns with an average laserpower between 1 W and around 5 W. Pre-specified operating modes can be set via acontroller, depending on an area of application, with the appropriate different
combinations of laser power and repetition rate. Thus, the same laser can optionally beused to perform a drilling operation, an etch removal operation or an exposureoperation. Using a galvo mirror deflector unit that can also be controlled via the
deflection unit, the laser beam may be deflected on the substrate in accordance with therelevant operating mode.
申请人：Sebastien Edme,Stefan Lesjak,Eddy Roelants
地址：Wissembourg FR,Ettlingen DE,Brugge BE
国籍：FR,DE,BE
代理机构：Harness, Dickey & Pierce, P.L.C.
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