专利名称：METAL-CLAD LAMINATE AND PRINTED
WIRING BOARD
发明人：Koji Kishino,Hiroharu Inoue,Takeshi Kitamura申请号：US14359909申请日：20121121
公开号：US20140311781A1公开日：20141023
专利附图：
摘要：A metal-clad laminate of the present invention includes an insulating layer and ametal layer disposed on at least one surface of the insulating layer. The insulating layer isformed by laminating at least a center layer and surface resin layers disposed on both
surfaces of the center layer. The center layer contains a heat-curable resin and includes acore layer containing at least one fibrous base material and a heat-curable resin layerthat does not contain a fibrous base material. The ratio of the thickness of the surfaceresin layer to the thickness of the heat-curable resin layer is between 0.5 and 10.
申请人：PANASONIC CORPORATION
地址：Osaka JP
国籍：JP
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