Stacked Semiconductor Components With Through Wire

专利名称：Stacked Semiconductor Components With

Through Wire Interconnects (TWI)

发明人：Alan G. Wood,David R. Hembree申请号：US11859776申请日：20070923

公开号：US20080042247A1公开日：20080221

专利附图：

摘要：A semiconductor component includes a semiconductor substrate having asubstrate contact, and a through wire interconnect (TWI) bonded to the substratecontact. The through wire interconnect (TWI) includes a via through the substrate contact

and the substrate, a wire in the via bonded to the substrate contact, and a contact on thewire. A stacked semiconductor component includes the semiconductor substrate, and asecond semiconductor substrate stacked on the substrate and bonded to a through wireinterconnect on the substrate. A method for fabricating a semiconductor component witha through wire interconnect includes the steps of providing a semiconductor substratewith a substrate contact, forming a via through the substrate contact and part waythrough the substrate, placing the wire in the via, bonding the wire to the substratecontact, and then thinning the substrate from a second side to expose a contact on thewire. A system for fabricating the semiconductor component includes a bonding capillaryconfigured to place the wire in the via, and to form a bonded connection between thewire and the substrate contact.

申请人：Alan G. Wood,David R. Hembree

地址：Boise ID US,Boise ID US

国籍：US,US

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