Method and apparatus for testing the connectivity

专利名称：Method and apparatus for testing the

connectivity of a flash memory chip

发明人：Sang Thanh Nguyen,Hieu Van Tran,Hung O.

Nguyen,Phil Klotzkin

申请号：US12629302申请日：20091202公开号：US08020055B2公开日：20110913

专利附图：

摘要：In one embodiment of the invention, circuitry and hardware for connectivitytesting are fabricated on an IC, and in particular an IC containing a flash memory array.

This testing circuitry is electrically connected to the bond pads of the IC. In some

embodiments, the testing circuitry includes a boundary scan cell connected to each bondpad, allowing for rapid connectivity testing of flash memory chips in accordance withtesting standards such as the JTAG standard. The invention further includes methods inwhich the pins and/or memory cells of a flash memory chip are sequentially sent a seriesof data so as to test the connectivity of portions of the IC. The sequentially-sent data isthen retrieved and compared to the original data. Discrepancies between these sets ofdata thus highlight connectivity problems in the IC.

申请人：Sang Thanh Nguyen,Hieu Van Tran,Hung O. Nguyen,Phil Klotzkin

地址：Union City CA US,San Jose CA US,Fremont CA US,Springfield NJ US

国籍：US,US,US,US

代理机构：DLA Piper LLP (US)

更多信息请下载全文后查看