专利名称:Semiconductor wafer level chip package and
method of manufacturing the same
发明人:Goon-Woo Kim,Man-Hee Han,Jae-Hong
Kim,Heui-Seog Kim,Sang-Jun Kim,Wha-Su Sin
申请号:US11431084申请日:20060510
公开号:US20070052094A1公开日:20070308
专利附图:
摘要:A semiconductor chip package may include one or more conductive patternsprovided on a front surface of a wafer. An encapsulation layer may cover at least the
front surface of the wafer. Chip plugs may be electrically connected to the conductivepatterns, and may be embedded in a rear surface of the wafer. External connectionterminals may be electrically connected to the chip plugs, and may be provided on therear surface of the wafer.
申请人:Goon-Woo Kim,Man-Hee Han,Jae-Hong Kim,Heui-Seog Kim,Sang-Jun Kim,Wha-Su Sin
地址:Cheonan-si KR,Cheonan-si KR,Cheonan-si KR,Cheonan-si KR,Cheonan-siKR,Cheonan-si KR
国籍:KR,KR,KR,KR,KR,KR
更多信息请下载全文后查看
因篇幅问题不能全部显示,请点此查看更多更全内容
Copyright © 2019- igat.cn 版权所有 赣ICP备2024042791号-1
违法及侵权请联系:TEL:199 1889 7713 E-MAIL:2724546146@qq.com
本站由北京市万商天勤律师事务所王兴未律师提供法律服务