专利名称：Colloidal silica based chemical mechanical
polishing slurry
发明人：Gert R.M. Moyaerts,Ken A.
Delbridge,Nichole R. Koontz,Saeed H.Mohseni,Gerome J. Sayles,Deepak Mahulikar
申请号：US11141162申请日：20050531
公开号：US20060124593A1公开日：20060615
专利附图：
摘要：A composition for chemical mechanical polishing a surface of a substrate having
a plurality of ultra high purity sol gel processed colloidal silica particles for chemicalmechanical polishing having alkali metals Li, Na, K, Rb, Cs, Fr and a combination thereof, ata total alkali concentration of about 300 ppb or less, with the proviso that theconcentration of Na, if present, is less than 200 ppb; and a medium for suspending theparticles is provided. Also, provided are methods of chemical mechanical polishing whichincluded a step of contacting a substrate and a composition according to the presentinvention. The contacting is carried out at a temperature and for a period of timesufficient to planarize the substrate.
申请人：Gert R.M. Moyaerts,Ken A. Delbridge,Nichole R. Koontz,Saeed H.Mohseni,Gerome J. Sayles,Deepak Mahulikar
地址：Phoenix AZ US,Chandler AZ US,Mesa AZ US,Sylvania OH US,Adrian MIUS,Madison CT US
国籍：US,US,US,US,US,US
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