Method of drilling of through-holes in printed cir

专利名称：Method of drilling of through-holes in

printed circuit board panels

发明人：Gaku, Morio, c/o Mitsubishi Gas Chemical Co.,

Inc.,Kimbara, Hidenori, c/o Toyo works

申请号：EP91307032.2申请日：19910731公开号：EP0470757A3公开日：19920624

摘要：A method of drilling a through-hole in a printed circuit board panel, whichcomprises placing a water-soluble lubricant sheet on one surface or each of two surfacesof a printed circuit board panel and drilling a through-hole though the printed circuitboard panel, the water-soluble lubricant sheet being composed of a mixture of 20 to 90% by weight of a polyethylene glycol having a weight average molecular weight of notless than 10,000 with 10 to 80 % by weight of a water-soluble lubricant and having athickness of 0.05 to 3 mm.

申请人：MITSUBISHI GAS CHEMICAL COMPANY, INC.

地址：No. 5-2, Marunouchi 2-chome Chiyoda-ku, Tokyo JP

国籍：JP

代理机构：Cresswell, Thomas Anthony

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