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SA58631资料

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SA58631

3 W BTL audio ampliﬁer

Rev. 02 — 12 October 2007

Product data sheet

1.General description

TheSA58631isaonechannelaudioampliﬁerinanHVSON8package.Itprovidespoweroutput of 3W with an 8Ω load at 9V supply. The internal circuit is comprised of a BTL(Bridge Tied Load) ampliﬁer with a complementary PNP-NPN output stage and

standby/mute logic. The SA58631 is housed in an 8-pin HVSON package which has anexposed die attach paddle enabling reduced thermal resistance and increased powerdissipation.

2.Features

IIIIIIIII

Low junction-to-ambient thermal resistance using exposed die attach paddleGain can be ﬁxed with external resistors from 6dB to 30dBStandby mode controlled by CMOS-compatible levelsLow standby current <10µANo switch-on/switch-off plops

High power supply ripple rejection: 50dB minimumElectroStatic Discharge (ESD) protectionOutput short circuit to ground protectionThermal shutdown protection

3.Applications

IProfessional and amateur mobile radio

IPortable consumer products: toys and gamesIPersonal computer remote speakers

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SA58631

3 W BTL audio ampliﬁer

4.Quick reference data

Table 1.Quick reference data

VCC=5V;Tamb=25°C;RL=8Ω;f=1kHz;VMODE=0V;measuredintestcircuitFigure3;unlessotherwise speciﬁed.SymbolVCCIqIstbPo

Parametersupply voltagequiescent currentstandby currentoutput power

ConditionsoperatingRL=∞ΩVMODE=VCCTHD+N=10%THD+N=0.5%THD+N=10%;VCC=9V

THD+NPSRR

total harmonic distortion-plus-noisePo=0.5Wpower supply rejection ratio

[2][3][1]

Min2.2--10.6--5040

Typ98-1.20.93.00.15--

Max181210---0.3--

UnitVmAµAWWW%dBdB

[1][2]

With a load connected at the outputs the quiescent current will increase, the maximum of this increasebeing equal to the DC output offset voltage divided by RL.

SupplyvoltageripplerejectionismeasuredattheoutputwithasourceimpedanceofRs=0Ωattheinput.The ripple voltage is a sinewave with a frequency of 1kHz and an amplitude of 100mV (RMS), which isapplied to the positive supply rail.

Supplyvoltageripplerejectionismeasuredattheoutput,withasourceimpedanceofRs=0Ωattheinput.The ripple voltage is a sinewave with a frequency between 100Hz and 20kHz and an amplitude of100mV (RMS), which is applied to the positive supply rail.

[3]

5.Ordering information

Table 2.TypenumberSA58631TKOrdering information

PackageNameHVSON8DescriptionVersionplasticthermalenhancedverythinsmalloutlinepackage;SOT909-1noleads; 8terminals; body 4 x 4 x 0.85mm

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6.Block diagram

SA58631IN−IN+VCC436RR5OUT−20 kΩ8OUT+SVR220 kΩMODE1STANDBY/MUTE LOGIC7GND002aac005Fig 1.Block diagram of SA586317.Pinning information

7.1Pinning

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7.2Pin description

Table 3.SymbolMODESVRIN+IN−OUT−VCCGNDOUT+

Pin description

Pin12345678

Descriptionoperating mode select (standby, mute, operating)half supply voltage, decoupling ripple rejectionpositive inputnegative input

negative output terminalsupply voltageground

positive output terminal

8.Functional description

The SA58631 is a single-channel BTL audio ampliﬁer capable of delivering 3W outputpower to an 8Ω load at THD+N=10% using a 9V power supply. Using the MODE pin,the device can be switched to standby and mute condition. The device is protected by aninternal thermal shutdown protection mechanism. The gain can be set within a range of6dB to 30dB by external feedback resistors.

8.1Power ampliﬁer

The power ampliﬁer is a Bridge Tied Load (BTL) ampliﬁer with a complementaryPNP-NPN output stage. The voltage loss on the positive supply line is the saturationvoltage of a PNP power transistor, on the negative side the saturation voltage of an NPNpower transistor. The total voltage loss is <1V. With a supply voltage of 9V and an 8Ωloudspeaker, an output power of 3W can be delivered to the load.

8.2Mode select pin (MODE)

The device is in Standby mode (with a very low current consumption) if the voltage at theMODE pin is greater than VCC−0.5V, or if this pin is ﬂoating. At a MODE voltage in therange between 1.5V and VCC−1.5V the ampliﬁer is in a mute condition. The mutecondition is useful to suppress plop noise at the output, caused by charging of the inputcapacitor.

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9.Limiting values

Table 4.Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).SymbolParameterVCCVIIORMTstgTambVP(sc)Ptot

[1]

ConditionsoperatingMin−0.3−0.3-

Max+18VCC+0.31+150+85102.3

UnitVVA°C°CVW

supply voltageinput voltage

repetitive peak output currentstorage temperatureambient temperatureshort-circuit supply voltagetotal power dissipation

AC and DC short-circuit safe voltage.

non-operatingoperating

[1]

−55−40--

HVSON8

10.Thermal characteristics

Table 5.SymbolRth(j-a)

Thermal characteristicsParameterthermal resistance from junction toambient

Conditionsfree air

9.7 cm2 (1.5in2)heatspreader32 cm2 (5in2)heatspreader

Rth(j-sp)

[1]

Typ8032285

UnitK/WK/WK/WK/W

[1]

thermal resistance from junction tosolder point

Thermal resistance is 28K/W with DAP soldered to 32 cm2 (5in2), 35µm copper (1ounce copper) heatspreader.

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11.Static characteristics

Table 6.Static characteristics

VCC=5V; Tamb=25°C; RL=8Ω; VMODE=0V; measured in test circuitFigure3; unless otherwise speciﬁed.SymbolVCCIqIstbVO∆VO(offset)IIB(IN+)IIB(IN−)VMODE

Parametersupply voltagequiescent currentstandby currentoutput voltage

differential output voltage offsetinput bias current on pin IN+input bias current on pin IN−voltage on pin MODE

operatingmutestandby

IMODE

[1][2]

ConditionsoperatingRL=∞ΩVMODE=VCC

[2][1]

Min2.2------01.5VCC−0.5-

Typ98-2.2-------

Max181210-505005000.5VCC−1.5VCC20

UnitVmAµAVmVnAnAVVVµA

current on pin MODE

0VWith a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the DC outputoffset voltage divided by RL.

The DC output voltage with respect to ground is approximately 0.5×VCC.

12.Dynamic characteristics

Table 7.Dynamic characteristics

VCC=5V; Tamb=25°C; RL=8Ω; f=1kHz; VMODE=0V; measured in test circuitFigure3; unless otherwise speciﬁed.SymbolPo

Parameteroutput powerConditionsTHD+N=10%THD+N=0.5%

THD+N=10%; VCC=9V

THD+NGv(cl)∆ZiVn(o)PSRRVo

[1][2][3][4][5]

Min10.6--[1]

Typ1.20.93.00.15-100----

Max---0.330-100--200

UnitWWW%dBkΩµVdBdBµV

total harmonic

distortion-plus-noiseclosed-loop voltage gaindifferential inputimpedance

noise output voltagepower supply rejectionratio

output voltage

Po=0.5W

[2][3][4]

-5040-

mute condition

[5]

Gain of the ampliﬁer is 2×(R2/R1) in test circuit ofFigure3.

The noise output voltage is measured at the output in a frequency range from 20Hz to 20kHz (unweighted), with a source impedanceof RS=0Ω at the input.

Supply voltage ripple rejection is measured at the output with a source impedance of Rs=0Ω at the input. The ripple voltage is asinewave with a frequency of 1kHz and an amplitude of 100mV (RMS), which is applied to the positive supply rail.

Supply voltage ripple rejection is measured at the output, with a source impedance of Rs=0Ω at the input. The ripple voltage is a

sinewavewithafrequencybetween100Hzand20kHzandanamplitudeof100mV(RMS),whichisappliedtothepositivesupplyrail.Output voltage in mute position is measured with an input voltage of 1V (RMS) in a bandwidth of 20kHz, which includes noise.

SA58631_2

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13.Application information

C11 µFR111 kΩR256 kΩVCCIN−IN+SVR4365OUT−RL100 nF100 µFVISA586312187GNDOUT+MODEC247 µF002aac007R2Gain=2×------R1Fig 3.Application diagram of SA58631 BTL differential output conﬁguration14.Test information

14.1Test conditions

The junction to ambient thermal resistance, Rth(j-a)=27.7K/W for the HVSON8 packagewhentheexposeddieattachpaddleissolderedto32cm2(5in2)areaof35µm(1ounce)copper heat spreader on the demo PCB. The maximum sinewave power dissipation forTamb=25°C is:150–25

--------------------=4.5W27.7

Thus, for Tamb=+85°C the maximum total power dissipation is:150–85

--------------------=2.35W27.7

The power dissipation versus ambient temperature curve (Figure5) shows the powerderating proﬁles with ambient temperature for three sizes of heat spreaders. For a moremodest heat spreader using 9.7 cm2 (1.5in2) area on the top side of the PCB, theRth(j-a)is31.25K/W. When the package is not soldered to a heat spreader, the Rth(j-a)increases to 83.3K/W.

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6.0Po(W)4.0RL = 8 Ω002aac0085.0P(W)4.03.0002aac009(3)(2)16 Ω2.02.01.00(1)005.010.015.0VCC (V)20.0050100Tamb (°C)150(1)No heat spreader.(2)Top only heat spreader (9.7 cm2 (1.5in2), 35µm(1ounce) copper).(3)Both top and bottom heat spreader (approximately32 cm2 (5in2), 35µm (1ounce) copper).Fig 4.Output power versus supply voltage @THD+N=10%; 32 cm2 (5in2) heat spreaderFig 5.Power dissipation versus ambient temperature14.2BTL application

Tamb=25°C, VCC=9V, f=1kHz, RL=8Ω, Gv=20dB, audio band-pass 20Hz to20kHz. The BTL diagram is shown inFigure3.

The quiescent current has been measured without any load impedance. The totalharmonic distortion+noise (THD+N) as a function of frequency was measured with alow-pass ﬁlter of 80kHz. The value of capacitor C2 inﬂuences the behavior of PSRR atlowfrequencies;increasingthevalueofC2increasestheperformanceofPSRR.Figure6shows three areas: operating, mute and standby. It shows that the DC switching levels ofthe mute and standby respectively depends on the supply voltage level.

The following characterization curves show the room temperature performance forSA58631 using the demo PCB shown inFigure21. The 8 curves for power dissipationversus output power (Figure10 throughFigure17) as a function of supply voltage, heatspreader area, load resistance and voltage gain show that there is very little difference inperformance with voltage gain; however, there are signiﬁcant differences with supplyvoltage and load resistance.

ThecurvesforTHD+Nversusoutputpower(Figure18)showthattheSA58631yieldsthebest power output using an 8Ω load at 9V supply. Under these conditions the partdelivers typically 3W output power for THD+N=10%.

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3 W BTL audio ampliﬁer

16VMODE(V)12standby002aac04215Iq(mA)10002aac0438mute45operating04812VCC (V)1600048121620VCC (V)Fig 6.VMODE versus VCC−20SVRR(dB)−40(1)(2)(3)Fig 7.Iq versus VCC002aac04410Vo(V)110−110−210−310−410−5(1)(2)(3)002aac045−60−8010102103104f (Hz)10510−610−1110VMODE (V)102VCC=5V;RL=8Ω; Rs=0Ω; VI=100mV.(1)Gv=30dB(2)Gv=20dB(3)Gv=6dBBand-pass=22Hz to 22kHz.(1)VCC=3V(2)VCC=5V(3)VCC=12VFig 8.SVRR versus frequencyFig 9.Vo versus VMODESA58631_2© NXP B.V. 2007. All rights reserved.

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3 W BTL audio ampliﬁer

5.0P(W)4.0VCC = 9.0 V3.02.05.0 V1.007.5 V002aac0275.0P(W)4.0VCC = 9.0 V3.02.01.007.5 V002aac0285.0 V00.61.21.8Po (W)2.400.61.21.8Po (W)2.4Fig 10.Power dissipation versus outputpower;RL=4.0Ω; Gv=10dB; 9.7 cm2 (1.5in2)heatspreader3.0P(W)2.0VCC = 9.0 V002aac029Fig 11.Power dissipation versus outputpower;RL=4.0Ω; Gv=20dB; 9.7 cm2 (1.5in2)heatspreader3.0P(W)2.0VCC = 9.0 V7.5 V002aac0307.5 V1.05.0 V1.05.0 V001.02.03.0Po (W)4.0001.02.03.0Po (W)4.0Fig 12.Power dissipation versus outputpower;RL=8.0Ω; Gv=10dB; 9.7 cm2 (1.5in2)heatspreader1.6P(W)1.27.5 V0.85.0 VVCC = 9.0 V002aac031Fig 13.Power dissipation versus outputpower;RL=8.0Ω; Gv=20dB; 9.7 cm2 (1.5in2)heatspreader1.6P(W)1.27.5 V0.85.0 VVCC = 9.0 V002aac0320.40.4001.02.0Po (W)3.0001.02.0Po (W)3.0Fig 14.Power dissipation versus outputpower;RL=16Ω; Gv=10dB; 9.7 cm2 (1.5in2)heatspreaderFig 15.Power dissipation versus outputpower;RL=16Ω; Gv=20dB; 9.7 cm2 (1.5in2)heatspreaderSA58631_2© NXP B.V. 2007. All rights reserved.

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3 W BTL audio ampliﬁer

3.0P(W)2.0VCC = 9.0 V002aac0331.6P(W)1.2VCC = 9.0 V002aac0347.5 V0.87.5 V1.05.0 V0.45.0 V001.02.03.0Po (W)4.0001.02.0Po (W)3.0Fig 16.Power dissipation versus outputpower;RL=8.0Ω; Gv=20dB; 32 cm2 (5in2)heatspreaderFig 17.Power dissipation versus outputpower;RL=16Ω; Gv=20dB; 32 cm2 (5in2)heatspreader102THD+N(%)101VCC = 5.0 V7.5 V9.0 V002aac035102THD+N(%)101VCC = 5.0 V7.5 V9.0 V002aac0361110−110−110−210−210−11Po (W)10110−210−210−11Po (W)101a.f=1kHz; RL=4Ω102THD+N(%)101VCC = 5.0 V7.5 V9.0 Vb.f=1kHz; RL=8Ω002aac037110−110−210−210−11Po (W)101c.f=1kHz; RL=16ΩFig 18.THD+N versus output powerSA58631_2© NXP B.V. 2007. All rights reserved.

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2.0THD+N(%)1.61.20.8002aac0381.2THD+N(%)0.8002aac0390.40.4010−1010−11f (kHz)1011f (kHz)101a.RL=4Ω1.0THD+N(%)0.80.60.40.2010−1b.RL=8Ω002aac0401f (kHz)101c.RL=16ΩFig 19.THD+N versus frequencySA58631_2© NXP B.V. 2007. All rights reserved.

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14.3Single-ended application

Tamb=25°C; VCC=7.5V; f=1kHz; RL=8Ω; Gv=20dB; audio band-pass 20Hz to20kHz.

The Single-Ended (SE) application diagram is shown inFigure20.

C11 µFR111 kΩR2110 kΩVCCIN−IN+SVR4365OUT−100 nFC3470 µF100 µFVISA58631217GND8OUT+RLC2MODE47 µF002aac041R2Gain=------R1Fig 20.SE application circuit conﬁgurationThe capacitor value of C3 in combination with the load impedance determines the lowfrequency behavior. The total harmonic distortion+noise as a function of frequency wasmeasured with a low-pass ﬁlter of 80kHz. The value of the capacitor C2 inﬂuences thebehavior of the PSRR at low frequencies; increasing the value of C2 increases theperformance of PSRR.

14.4General remarks

Thefrequencycharacteristicscanbeadaptedbyconnectingasmallcapacitoracrossthefeedback resistor. To improve the immunity of HF radiation in radio circuit applications, asmall capacitor can be connected in parallel with the feedback resistor (56kΩ); thiscreates a low-pass ﬁlter.

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14.5SA58631TK PCB demo

TheapplicationdemoboardmaybeusedforevaluationineitherBTLorSEconﬁgurationas shown in the schematics inFigure3 andFigure20. The demo PCB is laid out for the32 cm2 (5in2) heat spreader (total of top and bottom heat spreader area).

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15.Package outline

HVSON8: plastic thermal enhanced very thin small outline package; no leads;8 terminals; body 4 x 4 x 0.85 mm

SOT909-1

01scale2 mmXDBAEAA1cdetail Xterminal 1index areaterminal 1index area1e1eb4 v wMMCABCCy1CyLexposed tie bar (4×)Eh85DhDIMENSIONS (mm are the original dimensions)UNITmmA(1)max.1A10.050.00b0.40.3c0.2D(1)4.13.9Dh3.252.95E(1)4.13.9Eh2.352.05e0.8e12.4L0.650.40v0.1w0.05y0.05y10.1Note1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINEVERSION SOT909-1 REFERENCES IEC JEDECMO-229JEITAEUROPEANPROJECTIONISSUE DATE05-09-2605-09-28Fig 22.Package outline SOT909-1 (HVSON8)

SA58631_2

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16.Soldering

Thistextprovidesaverybriefinsightintoacomplextechnology.Amorein-depthaccountof soldering ICs can be found in Application NoteAN10365 “Surface mount reﬂowsoldering description”.

16.1Introduction to soldering

Soldering is one of the most common methods through which packages are attached toPrintedCircuitBoards(PCBs),toformelectricalcircuits.Thesolderedjointprovidesboththe mechanical and the electrical connection. There is no single soldering method that isideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is notsuitable for ﬁne pitch SMDs. Reﬂow soldering is ideal for the small pitches and highdensities that come with increased miniaturization.

16.2Wave and reﬂow soldering

Wavesolderingisajoiningtechnologyinwhichthejointsaremadebysoldercomingfroma standing wave of liquid solder. The wave soldering process is suitable for the following:

•Through-hole components

•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadlesspackages which have solder lands underneath the body, cannot be wave soldered. Also,leaded SMDs with leads having a pitch smaller than ~0.6mm cannot be wave soldered,due to an increased probability of bridging.

The reﬂow soldering process involves applying solder paste to a board, followed bycomponent placement and exposure to a temperature proﬁle. Leaded packages,packages with solder balls, and leadless packages are all reﬂow solderable.Key characteristics in both wave and reﬂow soldering are:

••••••

Board speciﬁcations, including the board ﬁnish, solder masks and viasPackage footprints, including solder thieves and orientationThe moisture sensitivity level of the packagesPackage placementInspection and repair

Lead-free soldering versus PbSn soldering

16.3Wave soldering

Key characteristics in wave soldering are:

•Process issues, such as application of adhesive and ﬂux, clinching of leads, board

transport, the solder wave parameters, and the time during which components areexposed to the wave

•Solder bath speciﬁcations, including temperature and impurities

SA58631_2

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16.4Reﬂow soldering

Key characteristics in reﬂow soldering are:

•Lead-freeversusSnPbsoldering;notethatalead-freereﬂowprocessusuallyleadsto

higher minimum peak temperatures (seeFigure23) than a PbSn process, thusreducing the process window

•Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

•Reﬂow temperature proﬁle; this proﬁle includes preheat, reﬂow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperatureishighenoughforthesoldertomakereliablesolderjoints(asolderpastecharacteristic). In addition, the peak temperature must be low enough that thepackages and/or boards are not damaged. The peak temperature of the packagedepends on package thickness and volume and is classiﬁed in accordance withTable8 and9

Table 8.

SnPb eutectic process (from J-STD-020C)

Package reﬂow temperature (°C)Volume (mm3)< 350< 2.5≥ 2.5Table 9.

235220

Lead-free process (from J-STD-020C)

Package reﬂow temperature (°C)Volume (mm3)< 350< 1.61.6 to 2.5> 2.5

260260250

350 to 2000260250245

> 2000260245245

≥ 350220220

Package thickness (mm)Package thickness (mm)Moisture sensitivity precautions, as indicated on the packing, must be respected at alltimes.

Studies have shown that small packages reach higher temperatures during reﬂowsoldering, seeFigure23.

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temperaturemaximum peak temperature= MSL limit, damage levelminimum peak temperature= minimum soldering temperaturepeak temperaturetime001aac844MSL: Moisture Sensitivity LevelFig 23.Temperature proﬁles for large and small componentsFor further information on temperature proﬁles, refer to Application NoteAN10365“Surface mount reﬂow soldering description”.

17.Abbreviations

Table 10.AcronymBTLCMOSDAPESDNPNPCBPNPRMSTHD

Abbreviations

DescriptionBridge Tied LoadComplementary Metal Oxide SiliconDie Attach PaddleElectroStatic DischargeNegative-Positive-NegativePrinted-Circuit BoardPositive-Negative-PositiveRoot Mean SquaredTotal Harmonic Distortion

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18.Revision history

Table 11.

Revision history

Release date20071012

Data sheet statusProduct data sheet

Change notice-SupersedesSA58631_1

Document IDSA58631_2Modiﬁcations:

••••

The format of this data sheet has been redesigned to comply with the new identityguidelines of NXP Semiconductors.

Legal texts have been adapted to the new company name where appropriate.Figure4: changed incorrect character fontSoldering information updated

Product data sheet

SA58631_120060308

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19.Legal information

19.1Data sheet status

Document status[1][2]Objective [short] data sheetPreliminary [short] data sheetProduct [short] data sheet

[1][2][3]

Product status[3]DevelopmentQualiﬁcationProduction

DeﬁnitionThis document contains data from the objective speciﬁcation for product development.This document contains data from the preliminary speciﬁcation.This document contains the product speciﬁcation.

Please consult the most recently issued document before initiating or completing a design.The term ‘short data sheet’ is explained in section “Deﬁnitions”.

Theproductstatusofdevice(s)describedinthisdocumentmayhavechangedsincethisdocumentwaspublishedandmaydifferincaseofmultipledevices.Thelatestproductstatusinformation is available on the Internet at URLhttp://www.nxp.com.

19.2Deﬁnitions

Draft —The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodiﬁcations or additions. NXP Semiconductors does not give anyrepresentations or warranties as to the accuracy or completeness of

informationincludedhereinandshallhavenoliabilityfortheconsequencesofuse of such information.

Short data sheet —A short data sheet is an extract from a full data sheetwiththesameproducttypenumber(s)andtitle.Ashortdatasheetisintendedforquickreferenceonlyandshouldnotbereliedupontocontaindetailedandfull information. For detailed and full information see the relevant full datasheet, which is available on request via the local NXP Semiconductors salesofﬁce. In case of any inconsistency or conﬂict with the short data sheet, thefull data sheet shall prevail.

malfunctionofaNXPSemiconductorsproductcanreasonablybeexpectedtoresult in personal injury, death or severe property or environmental damage.NXP Semiconductors accepts no liability for inclusion and/or use of NXPSemiconductors products in such equipment or applications and thereforesuch inclusion and/or use is at the customer’s own risk.

Applications —Applications that are described herein for any of theseproducts are for illustrative purposes only. NXP Semiconductors makes norepresentation or warranty that such applications will be suitable for thespeciﬁed use without further testing or modiﬁcation.

Limiting values —Stress above one or more limiting values (as deﬁned intheAbsoluteMaximumRatingsSystemofIEC60134)maycausepermanentdamagetothedevice.Limitingvaluesarestressratingsonlyandoperationofthe device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limitingvalues for extended periods may affect device reliability.

Terms and conditions of sale —NXP Semiconductors products are soldsubjecttothegeneraltermsandconditionsofcommercialsale,aspublishedathttp://www.nxp.com/proﬁle/terms, including those pertaining to warranty,intellectual property rights infringement and limitation of liability, unlessexplicitly otherwise agreed to in writing by NXP Semiconductors. In case ofany inconsistency or conﬂict between information in this document and suchterms and conditions, the latter will prevail.

No offer to sell or license —Nothing in this document may be interpretedor construed as an offer to sell products that is open for acceptance or thegrant,conveyanceorimplicationofanylicenseunderanycopyrights,patentsor other industrial or intellectual property rights.

19.3Disclaimers

General —Information in this document is believed to be accurate and

reliable.However,NXPSemiconductorsdoesnotgiveanyrepresentationsorwarranties,expressedorimplied,astotheaccuracyorcompletenessofsuchinformation and shall have no liability for the consequences of use of suchinformation.

Right to make changes —NXPSemiconductorsreservestherighttomakechanges to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and withoutnotice.Thisdocumentsupersedesandreplacesallinformationsuppliedpriorto the publication hereof.

Suitability for use —NXP Semiconductors products are not designed,authorized or warranted to be suitable for use in medical, military, aircraft,space or life support equipment, nor in applications where failure or

19.4Trademarks

Notice:Allreferencedbrands,productnames,servicenamesandtrademarksare the property of their respective owners.

20.Contact information

For additional information, please visit:http://www.nxp.com

For sales ofﬁce addresses, send an email to:salesaddresses@nxp.com

Product data sheetRev. 02 — 12 October 200720 of 21

元器件交易网www.cecb2b.com

NXP Semiconductors

21.Contents

1General description. . . . . . . . . . . . . . . . . . . . . . 12Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Quick reference data. . . . . . . . . . . . . . . . . . . . . 25Ordering information. . . . . . . . . . . . . . . . . . . . . 26Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 37Pinning information. . . . . . . . . . . . . . . . . . . . . . 37.1Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37.2Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 48Functional description . . . . . . . . . . . . . . . . . . . 48.1Power ampliﬁer. . . . . . . . . . . . . . . . . . . . . . . . . 48.2Mode select pin (MODE) . . . . . . . . . . . . . . . . . 49Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 510Thermal characteristics. . . . . . . . . . . . . . . . . . . 511Static characteristics. . . . . . . . . . . . . . . . . . . . . 612Dynamic characteristics . . . . . . . . . . . . . . . . . . 613Application information. . . . . . . . . . . . . . . . . . . 714Test information. . . . . . . . . . . . . . . . . . . . . . . . . 714.1Test conditions . . . . . . . . . . . . . . . . . . . . . . . . . 714.2BTL application. . . . . . . . . . . . . . . . . . . . . . . . . 814.3Single-ended application . . . . . . . . . . . . . . . . 1314.4General remarks. . . . . . . . . . . . . . . . . . . . . . . 1314.5SA58631TK PCB demo . . . . . . . . . . . . . . . . . 1415Package outline . . . . . . . . . . . . . . . . . . . . . . . . 1516Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1616.1Introduction to soldering. . . . . . . . . . . . . . . . . 1616.2Wave and reﬂow soldering . . . . . . . . . . . . . . . 1616.3Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 1616.4Reﬂow soldering. . . . . . . . . . . . . . . . . . . . . . . 1717Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 1818Revision history. . . . . . . . . . . . . . . . . . . . . . . . 1919Legal information. . . . . . . . . . . . . . . . . . . . . . . 2019.1Data sheet status . . . . . . . . . . . . . . . . . . . . . . 2019.2Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2019.3Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 2019.4Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 2020Contact information. . . . . . . . . . . . . . . . . . . . . 2021

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

SA58631

3 W BTL audio ampliﬁer

Pleasebeawarethatimportantnoticesconcerningthisdocumentandtheproduct(s)described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 12 October 2007Document identifier: SA58631_2

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