Method of preparing thermally conductive compounds

专利名称：Method of preparing thermally conductive

compounds by liquid metal bridged particleclusters

发明人：Misra, Sanjay申请号：EP01303104.2申请日：20010330公开号：EP1143511A2公开日：20011010

专利附图：

摘要：A thermally conductive mechanically compliant pad of high stability including aquantity of gallium and/or indium alloy liquid at temperatures below about 120°C and a

boron nitride particulate solid blended into the liquid metal alloy to form a paste. Thepaste is then combined with a quantity of a flowable plastic resin consisting of a blend ofsilicone oil and octyl-ethoxysilane to form the mechanically compliant pad, the compliantpad comprising from between about 10% and 90% of metallic coated particulate, balanceflowable plastic resin blend.

申请人：The Bergquist Company

地址：130 West 78th Street Chanhassen, Minnesota 55317 US

国籍：US

代理机构：Charig, Raymond Julian

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