专利名称：Feedthrough assembly
发明人：Brad C. Tischendorf,Andrew J. Thom申请号：US16786078申请日：20200210公开号：US11058883B2公开日：20210713
专利附图：
摘要：A feedthrough assembly includes: a ferrule; an insulating structure; and a sealfixedly securing the insulating structure within the ferrule, the seal comprising a glass andsingle-phase particulate dispersed therein; wherein the glass includes: 25% to 40% BO; 0to 25% CaO; 0 to 25% MgO; 0 to 25% SrO; 0 to 10% LaO; 5% to 15% SiO; and 10% to 20%
AlO; wherein all percentages are mole percentages of the glass.
申请人：Medtronic, Inc.
地址：Minneapolis MN US
国籍：US
代理机构：Mueting Raasch Group
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