ALLEGRO使用（V16.2）-DRC错误代码对照 代码 单一字符代码 L P V K C E J I 相关对象 Line Pin Via Keep in/out Component Electrical Constraint T-Junction Island Form 说明 走线 元件脚 贯穿孔 允许区域/禁止区域 元件层级 电气约束 呈现T形的走线 被Pin或Via围成的负片孤铜 与走线相关的错误 与整个电路板相关的错误 与防焊层相关的错误 与走线层的Shape或分支相关的错误 与不允许的设置相关的错误 与宽度相关的错误 Bondpad之间的错误 Bondpad与Line之间的错误 Bondpad与Shape 之间的错误 Package之间的 Spacing 错误 Soldermask零件防焊层之间的Spacing 错误 差分对走线的长度误差过长 Max 差分对走线的主要距离太大 Max 差分对走线的次要距离太大 错误代码前置码说明 W D M Wire Design Soldemask 错误代码后置码说明 S N W 双字符错误代码 BB BL BS CC Shape/Stub Not Allowed Width Bondpad to Bondpad Bondpad to Line Bondpad to Shape Package to Package Symbol Soldermask to Symbol Differential Pair Length Tolerance Differential Separation Differential Separation Pair Pair Primary Secondary DF Differential Pair Secondary Max Length 差分对走线的次要距离长度过长 DI ED Design Constraint Negative Plane 负片孤铜的错误 Island Propagation-Delay Relative-Propagation-Delay 走线的长度错误 走线的等长错误 EL EP ES ET EV EX HH HW IM JN Max Exposed Length 走线在外层（TOP&BOTTOM）的长度过长 Max Net Parallelism Length-Distance 已超过Net之间的平行长度 Pair Max Stub Length Electrical Topology Max Via Count Max Crosstalk Max Peak Crosstalk Hold to Hold Spacing Diagonal Wire to Hold Spacing Hold to Orthogonal Wire Spacing Impedance Constraint T Junction Not Allowed Route Keepin to Bondpad Route keepout to Bondpad Via Keepout to Bondpad Bondpad在Via Keepout之内 元件在Place Keepin之外 元件在Place Keepout之内 走线在Route Keepin之外 走线在Route Keepout之内 Shape在Route Keepin之外 Shape在Route Keepout之内 BBVia在Route Keepin之外 BBVia在Route Keepout之内 BBVia在Via Keepout之内 Test Via在Route Keepin之外 Test Via在Route Keepout之内 Test Via在Via Keepout之内 走线的分支过长 走线连接方式的错误 已超过走线使用的VIA的最大数目 已超过Crosstalk值 已超过Peak Crosstalk值 钻孔之间的距离太近 斜线与钻孔之间的距离太近 钻孔与垂直/水平线之间的距离太近 走线的阻抗值错误 走线呈T形的错误 Bondpad在Keepin之外 Bondpad在keepout之内 KB KC KL KS Package to Place Keepin Spacing Package to Place Keepout Spacing Line to Route Keepin Spacing Line to Route Keepout Spacing Shape to Route Keepin Spacing Shape to Route Keepout Spacing BBVia to Route Keepin Spacing BBVia to Route Keepout Spacing BBVia to Via Keepout Spacing Test Via to Route Keepin Spacing KV Test Via to Route Keepout Spacing Test Via to Via Keepout Spacing Through Via to Route Keepin Spacing Through Via在Route Keepin之外 Through Via to Route Keepout Spacing Through Via在Route Keepout之内 Through Via to Via Keepout Spacing LB LL LS LW Min Self Crossing Loopback Length Line to Line Spacing Line to Shape Spacing Min Line Width Through Via在Via Keepout之内 无 走线之间太近 走线与Shape 太近 走线的宽度太细 Min Neck Width MA MC MM PB PL Soldermask Alignment Error Pad Pin/Via Soldermask Soldermask Pin/Via Soldermask Soldermask Pin to Bondpad Line to SMD Pin Spacing Line to Test Pin Spacing Line to Through Pin Spacing SMD Pin to SMD Pin Spacing SMD Pin to Test Pin Spacing Test Pin to Test Pin Spacing PP Test Pin to Through Pin Spacing Through Pin to SMD Pin Spacing Through Pin to Through Pin Spacing Shape to SMD Pin Spacing PS Shape to Test Pin Spacing Through Pin to Shape Spacing BBVia to SMD Pin Spacing BBVia to Test Pin Spacing BBVia to Through Pin Spacing SMD Pin to Test Via Spacing PV SMD Pin to Through Via Spacing Test Pin to Test Via Spacing Test Pin to Through Via Spacing Test Via to Through Pin Spacing Through Pin to Through Via Spacing RC Package to Hard Room to to 走线变细的宽度太细 Soldermask Tolerance太小 Symbol Pad与Symbol Soldermask之间的错误 Pin/Via Pad Soldermask之间的错误 Pin与Bondpad之间的错误 走线与SMD元件脚太近 走线与Test元件脚太近 走线与Through元件脚太近 SMD元件脚与SMD元件脚太近 SMD元件脚与Test元件脚太近 Test元件脚与Test元件脚太近 Test元件脚与Through元件脚太近 Through元件脚与SMD元件脚太近 Through元件脚与Through元件脚太近 Shape与SMD元件脚太近 Shape与Test元件脚太近 Through元件脚与Shape太近 BBVia与SMD元件脚太近 BBVia与Test元件脚太近 BBVia 与Through元件脚太近 SMD Pin与Test Via太近 SMD Pin与Through Via太近 Test Pin与Test Via太近 Test Pin与Through Via太近 Test Via与Through Pin太近 Through Pin与Through Via太近 元件在其他的Room之内 RE Min Length Route End Segment at 无 135Degree Min Length Route End Segment at 无 45/90Degree 135Degree Turn to Adjacent Crossing 无 Distance 90Degree Turn to Adjacent Crossing 无 Distance Min Length Wire Segment Min Length Single Segment Wire 无 无 SB SL SN SO BB SS TA VB Allow on Etch Subclass Segment Orientaion Bondpad to Bondpad Shape to Shape Max Turn Angle Via to Bondpad Max BB Via Stagger Distance Min BB Via Gap Min BB Via Stagger Distance Pad/Pad Direct Connect BB Via to Line Spacing 允许在走线层上 无 Bondpad之间的错误 Shape之间的错误 无 Via 与Bondpad之间的错误 同一段线的BB Via之间的距离太长 BB Via之间太近 同一段线的BB Via之间的距离太近 Pad 在另一个Pad 之上 BB Via与走线太近 走线与Through Via太近 走线与Test Via太近 BB Via与Shape太近 Shape 与Test Via太近 Shape与Through Via太近 BB Via之间太近 BB Via与Test Via太近 BB Via与Through Via太近 Test Via之间太近 Test Via与Through Via太近 Through Via之间太近 Bonding Wire 长度太短 无 VG VL Line to Through Via Spacing Line to Test Via Spacing BB Via to Shape Spacing VS Shape to Test Via Spacing Shape to Through Via Spacing BB Via to BB Via Spacing BB Via to Test Via Spacing VV BB Via to Through Via Spacing Test Via to Test Via Spacing Test Via to Through Via Spacing Through Via to Through Via Spacing WA Min Bonding Wire Length Min End Segment Length WE Min Length Wire End Segment at 无 135Degree Min Length Wire End Segment at 无 45/90Degree WI Max Bonding Wire Length Bonding Wire 长度太长 Diagonal Wire to Diagonal Wire 斜线之间太近 Spacing WW Diagonal Wire to Orthogonal Wire 斜线与垂直/水平线之间的距离太Spacing 近 Orthogonal Wire to Orthogonal Wire 垂直/水平线之间的距离太近 Spacing WX Max Number of Crossing Min Distance between Crossing 无 无 XB 135 Degree Turn to Adjacent Crossing 无 Distance 90 Degree Turn to Adjacent Crossing 无 Distance XD XS Externally Determined Violation Crossing to Distances Adjacent 无 Segment 无
