专利名称：Flip chip type semiconductor device and
method for manufacturing the same
发明人：Hirokazu Honda申请号：US10131486申请日：20020425
公开号：US200201216A1公开日：20020905
专利附图：
摘要：A multilayer wiring structure is formed on a flat metal plate and then an entiresurface of the metal plate is etched away to thereby leave only a multilayer wiring layer.An insulating substrate having through hole sections is bonded to the multilayer wiring
layer, a conductive bonding agent is embedded into the through hole section, asemiconductor chip is mounted and a solder ball is coupled.
申请人：NEC CORPORATION
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