Sample processing method and apparatus

专利名称：Sample processing method and apparatus发明人：Kawasaki, Yoshinao,Kawahara,

Hironobu,Sato, Yoshiaki,Fukuyama,Ryooji,Nojiri, Kazuo,Torii, Yoshimi

申请号：EP90301267.2申请日：19900207公开号：EP0385590B1公开日：19970502

摘要：A method and apparatus for processing a sample comprises etching the sampleby means (10; 11-14) of an etching plasma, and then treating the sample by means (20-21) of a second plasma, to remove residual corrosive compounds formed by the etchingplasma. Removal of the residual corrosive compounds and prevention of corrosion ismuch improved by contacting (30, 31) the surface of the sample after the second plasmatreatment with at least one liquid in order to effect at least one of (a) removal of theresidual corrosive compounds and (b) passivation of said surface exposed by steps, anddrying (41) the sample.

申请人：HITACHI LTD

地址：JP

国籍：JP

代理机构：Paget, Hugh Charles Edward

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