专利名称：Substrate coating unit and substrate coating
method
发明人：Shinji Kobayashi,Takahiro Kitano,Masateru
Morikawa,Kazuhiro Takeshita,YoshiyukiKawafuchi
申请号：US10101707申请日：20020321公开号：US06860945B2公开日：20050301
专利附图：
摘要：The present invention is a coating unit for applying a coating solution to a
substrate which includes: a discharge nozzle for reciprocating in a predetermineddirection above the substrate and discharging the coating solution to the substrate; aholder for holding the substrate and horizontally movable in one direction perpendicularto the predetermined direction; and a cover for covering an upper face of the substratewhen the substrate is moved in the one direction to be more forward than the dischargenozzle as viewed from a plane, wherein a lower face of the cover is inclined such as to behigher on the discharge nozzle side. According to the present invention, the covercovering the upper face of the substrate restrains a solvent from evaporating from thecoating solution applied on the substrate to secure flatness of a coating film.
申请人：Shinji Kobayashi,Takahiro Kitano,Masateru Morikawa,KazuhiroTakeshita,Yoshiyuki Kawafuchi
地址：Kumamoto JP,Kumamoto JP,Kumamoto JP,Kumamoto JP,Kumamoto JP
国籍：JP,JP,JP,JP,JP
代理机构：Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
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