Wafer-level flipped die stacks with leadframes or

专利名称：Wafer-level flipped die stacks with

leadframes or metal foil interconnects

发明人：Ashok S. Prabhu,Rajesh Katkar,Sean Moran申请号：US15342744申请日：20161103公开号：US09666513B2公开日：20170530

专利附图：

摘要：An assembly includes a plurality of stacked encapsulated microelectronicpackages, each package including a microelectronic element having a front surface with aplurality of chip contacts at the front surface and edge surfaces extending away from the

front surface. An encapsulation region of each package contacts at least one edgesurface and extends away therefrom to a remote surface of the package. The packagecontacts of each package are disposed at a single one of the remote surfaces, thepackage contacts facing and coupled with corresponding contacts at a surface of asubstrate nonparallel with the front surfaces of the microelectronic elements therein.

申请人：Invensas Corporation

地址：San Jose CA US

国籍：US

代理机构：Lerner, David, Littenberg, Krumholz & Mentlik, LLP

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