Multi-spindle chemical mechanical planarization to

专利名称：Multi-spindle chemical mechanical

planarization tool

发明人：Michael A. Cobb,Mahadevaiyer

Krishnan,Michael F. Lofaro,Dennis G. Manzer

申请号：US13605363申请日：20120906公开号：US085912B2公开日：20131126

专利附图：

摘要：An apparatus for chemical mechanical planarization includes a spindle assemblystructure and at least one substrate carrier, which make a linear lateral movement

relative to each other while abrasive surfaces of a plurality of cylindrical spindles in thespindle assembly structure contact, and rotate against, at least one substrate mountedon the at least one substrate carrier. The direction of the linear lateral movement iswithin the plane that tangentially contacts the plurality of cylindrical spindles, and can beorthogonal to the axes of rotation of the plurality of cylindrical spindles.

申请人：Michael A. Cobb,Mahadevaiyer Krishnan,Michael F. Lofaro,Dennis G. Manzer

地址：Croton on Hudson NY US,Hopewell Junction NY US,Hopewell Junction NYUS,Beford Hills NY US

国籍：US,US,US,US

代理机构：Scully, Scott, Murphy & Presser, P.C.

代理人：Louis J. Percello, Esq.

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