Apparatus for testing semiconductor devices using

专利名称：Apparatus for testing semiconductor

devices using a conductive sheet

发明人：Yasushi Ideta,Tsunenori Umezu,Akihiro

Washitani

申请号：US08/223538申请日：19940405公开号：US044388A公开日：19950822

摘要：A semiconductor apparatus for functionally inspecting semiconductor devices isdesigned to prevent contact failure, deformation, and the like caused by soldertransferred from external leads of semiconductor devices and deposited on contactterminals of the inspection apparatus. A sheet having metal-film patterns correspondingto an array of external leads of a semiconductor device is interposed between theexternal leads and the contact terminals to electrically connect the external leads to thecontact terminals. The semiconductor device is inspected and the sheet is changed at asuitable time when it is contaminated with solder.

申请人：MITSUBISHI DENKI KABUSHIKI KAISHA

代理机构：Leydig, Voit & Mayer

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