专利名称：SOLDER POWDER AND METHOD FOR
PREPARING THE SAME AND SOLDER PASTE
发明人：HIRATA, MASAHIKO,OHASHI,
TAKASHI,YOSHIDA, HISAHIKO,NOGUCHI,HIROJI,HISAZUMI, TAKAO,SENNA,MAMORU,ISOBE, TETSUHIKO
申请号：EP99926891申请日：19990701公开号：EP1099507A4公开日：20040825
摘要：An organic acid salt is deposited on the surface of a solder powder containingSn and Zn. Alternatively, 0.5 to 10 wt.% of a nonionic surfactant is added to a flux. By amethod comprising such a procedure, provided are a lead-free solder powder and solderpaste having good soldering characteristics wherein the reaction of an activatingcomponent with an alloy component in a flux is suppressed.
申请人：MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容