Method of soldering lead-free solder, and joined o

专利名称：Method of soldering lead-free solder, and

joined object soldered by the solderingmethod

发明人：Kazumi Matsushige,Toshihisa

Horiuchi,Takashi Ikari,KenichiroSuetsugu,Masato Hirano,ShunjiHibino,Atsushi Yamaguchi

申请号：US10759191申请日：20040120

公开号：US20040144829A1公开日：20040729

专利附图：

摘要：There are provided a method of soldering a lead-free solder which lowers amelting point of the lead-free solder and prevents deterioration of a joining strength at aportion joined by the lead-free solder, and a joined object soldered with the use of thesoldering method. The lead-free solder as an alloy of tin with no lead contained ismelted, and ultrasonic vibration is acted at least either to the join object to be joined bythe lead-free solder or to the lead-free solder when the molten lead-free solder issolidified. Therefore crystals of contained components in the lead-free solder are madefine and the contained components are prevented from being segregated at a joininginterface of the joined object, so that the joining strength at the joining interface can beincreased.

申请人：MATSUSHIGE KAZUMI,HORIUCHI TOSHIHISA,IKARI TAKASHI,SUETSUGUKENICHIRO,HIRANO MASATO,HIBINO SHUNJI,YAMAGUCHI ATSUSHI

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