Method for controlling solder printer

专利名称：Method for controlling solder printer发明人：David A. Tribbey,Donald P. Gebbia申请号：US07/850001申请日：19920310公开号：US05232736A公开日：19930803

摘要：A method for controlling the mass of solder applied to a printed circuitsubstrate (202) by a solder printer (200), whereby the mass of solder paste (114) appliedto a printed circuit substrate (202) is controlled by measuring the mass of the solderpaste (114) that was applied to a first printed circuit substrate. The mass data measuredis then compared to a predetermined mass to produce a control signal. The mass of thesolder applied to a second printed circuit substrate is controlled as a function of thecontrol signal so that the mass of the solder applied to the second substrate moreclosely approaches the predetermined mass.

申请人：MOTOROLA, INC.

代理人：Pablo Meles,William E. Koch,Thomas G. Berry

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