专利名称：METAL THIN FILM CONNECTION
STRUCTURE, MANUFACTURING METHODTHEREOF AND ARRAY SUBSTRATE
发明人：Wei QIN,Zhilong PENG申请号：US13150406申请日：20110601
公开号：US20110304060A1公开日：20111215
专利附图：
摘要：Embodiments of the invention relates to a metal thin film connection structure,comprising a first metal layer pattern; a second metal layer pattern which is separately
disposed with the first metal layer pattern; a first insulating layer formed on the firstmetal layer pattern and the second metal layer pattern; a plurality of first via holesformed over the first metal layer pattern; a plurality of second via holes formed over thesecond metal layer pattern; and a plurality of third metal layer patterns formed on thefirst insulating layer, the third metal layer patterns being filled in the first via holes andthe second via holes and electrically connect the first metal layer pattern and the secondmetal layer pattern through the first and second via holes. The embodiments of theinvention also provide an array substrate comprising the metal thin film connectionstructure and a manufacturing method for the metal thin film connection structure.
申请人：Wei QIN,Zhilong PENG
地址：Beijing CN,Beijing CN
国籍：CN,CN
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