Adhesive bonding of printed circuit boards to heat

专利名称：Adhesive bonding of printed circuit boards

to heat sinks

发明人：Kunno John Warn申请号：US10247385申请日：20020919

公开号：US20030019562A1公开日：20030130

专利附图：

摘要：Voids () at the interface of a printed circuit board () bonded to a heat sink ()which impede heat transfer from a heat generating electronic component () mounted onthe printed circuit board () to the heat sink (), and thus limit the density of electronic

components () that may be mounted to a given printed circuit board () are avoided by amethod wherein the adhesive securing the printed circuit board () to the heat sink () isformed of a pressure sensitive adhesive layer () and a thermosetting adhesive layer (). Thelatter fills the voids and thus provides for greater thermal conductivity from a heatgenerating component () to the heat sink () with the result in increase in heat rejection ().

申请人：WARN KUNNO JOHN

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