专利名称：Micro-coaxial substrate发明人：Richard C. Landis申请号：US06/671276申请日：19841114公开号：US04673904A公开日：19870616
摘要：A support board or substrate is disclosed for interconnecting various electroniccomponents. One or more conductors are imbedded within the substrate for
interconnecting the components. Each conductor is provided with shielding to permit theexchange of high frequency signals between the components without cross-coupledinterference.
申请人：ITT CORPORATION
代理人：Peter C. Van Der Sluys
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