BAS116-7-F;BAS116;中文规格书,Datasheet资料

BAS116 SURFACE MOUNT LOW LEAKAGE DIODE

Features

• • • •

Surface Mount Package Ideally Suited for Automated Insertion Very Low Leakage Current

Lead Halogen and Antimony Free, RoHS Compliant \"Green\" Device (Notes 1 and 2)

Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

• Case: SOT23 • Case Material: Molded Plastic. UL Flammability Classification

Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020 • Terminals: Matte Tin Finish annealed over Alloy 42 leadframe

(Lead Free Plating). Solderable per MIL-STD-202, Method 208 • Polarity: See Diagram • Weight: 0.008 grams (approximate)

Top View

Top View

Internal Schematic

SOT23

Ordering Information (Note 3)

Part Number BAS116-7-F BAS116-13-F BAS116Q-7-F BAS116Q-13-F

Notes:

Qualification Case Commercial SOT23 Commercial SOT23 Automotive SOT23 Automotive SOT23 Packaging

3,000/Tape & Reel 10,000/Tape & Reel 3,000/Tape & Reel 10,000/Tape & Reel

1. No purposefully added lead. Halogen and Antimony Free.

2. Product manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. 3. For packaging details, go to our website at http://www.diodes.com.

Marking Information

Date Code Key

Year Code

XXXXXX = Product Type Marking Code; K50, K YM = Date Code Marking Y = Year (ex: Y = 2011)

M = Month (ex: 9 = September)

2001 M 2002 N ….. ….. 2009 W

YM2010 X

2011 Y 2012 Z 2013 A 2014 B 2015 C 2016 D 2017 E

Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec

Code 1 2 3 4 5 6 7 8 9 O N D

BAS116

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Document number: DS30233 Rev. 10 - 2

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BAS116Maximum Ratings @TA = 25°C unless otherwise specified

Characteristic Symbol Value Unit VRRM Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage 85 V VRWM DC Blocking Voltage VR

60 V RMS Reverse Voltage VR(RMS)

215 mA Forward Continuous Current (Note 4) IFM

500 mA Repetitive Peak Forward Current IFRM

4.0 Non-Repetitive Peak Forward Surge Current @ t = 1.0μs

1.0 A @ t = 1.0ms IFSM

0.5 @ t = 1.0s

Thermal Characteristics

Characteristic Symbol Value Unit 250 mW PD Power Dissipation (Note 4) @TA = 25°C

Thermal Resistance Junction to Ambient Air (Note 4) @TA = 25°C

Operating and Storage Temperature Range

RθJA TJ, TSTG

500 -65 to +150

°C/W °C

Electrical Characteristics @TA = 25°C unless otherwise specified

Characteristic SymbolReverse Breakdown Voltage (Note 5) V(BR)R Forward Voltage

VF

Leakage Current (Note 5) Total Capacitance Reverse Recovery Time

Notes:

IR CT trr

Min Typ Max Unit Test Condition 85 V ⎯ ⎯ IR = 100μA

IF = 1.0mA 0.90

IF = 10mA 1.0

V ⎯ ⎯

1.1 IF = 50mA 1.25 IF = 150mA

VR = 75V 5.0 nA

⎯ ⎯

80 nA VR = 75V, Tj = 150°C

2 pF ⎯ ⎯ VR = 0, f = 1.0MHz

IF = IR = 10mA,

3.0 μs ⎯ ⎯

Irr = 0.1 x IR, RL = 100Ω

4. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com. 5. Short duration pulse test used to minimize self-heating effect.

300PD, POWER DISSIPATION (mW)250300Note 4RθJA = 500°C/W250IF, FORWARD CURRENT (mA)2002001501501001005005000255075100125TA, AMBIENT TEMPERATURE (°C)Fig. 1 Power Derating Curve1500

50100150TA, AMBIENT TEMPERATURE (°C)Fig. 2 Current Derating Curve200

BAS116

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Document number: DS30233 Rev. 10 - 2

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IF, INSTANTANEOUS FORWARD CURRENT (mA)1,000BAS11610VR = 75V10TA = 150°CTA = 125°CIR, REVERSE CURRENT (nA)10011TA = 85°CTA = 25°C0.10.0100.20.40.60.81.01.21.41.6VF, INSTANTANEOUS FORWARD VOLTAGE (V)Fig. 3 Typical Forward Characteristics0.1050100150TA, AMBIENT TEMPERATURE (°C)Fig. 4 Typical Reverse Characteristics200

Package Outline Dimensions A

BCHKJFDGLK1MSOT23

Dim Min Max Typ A 0.37 0.51 0.40 B 1.20 1.40 1.30 C 2.30 2.50 2.40 D 0. 1.03 0.915 F 0.45 0.60 0.535 G 1.78 2.05 1.83 H 2.80 3.00 2.90 J 0.0130.10 0.05 K 0.9031.10 1.00 K1 - - 0.400 L 0.45 0.61 0.55 M 0.0850.18 0.11 0° 8° - α

All Dimensions in mm

Suggested Pad Layout

YZC

DimensionsValue (in mm)

Z 2.9 X 0.8 Y 0.9 C 2.0 E 1.35

XEBAS116

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Document number: DS30233 Rev. 10 - 2

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BAS116IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

Copyright © 2011, Diodes Incorporated

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BAS116

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Document number: DS30233 Rev. 10 - 2

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November 2011

© Diodes Incorporated

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