Device and method for manufacturing substrate

专利名称：Device and method for manufacturing

substrate

发明人：並木 計介,福島 誠,鍋谷 治申请号：JP2018059670申请日：20180327公开号：JP2019171492A公开日：20191010

专利附图：

摘要：Problem to be solved: to provide a substrate holding device capable ofsuppressing variation in polishing rate in the circumferential direction of the substrate.The substrate holding device 1 comprises a polishing head body 10, a dry ring 81

disposed below the polishing head body 10, and a retainer ring 40 fixed to the dry ring81.The driving ring 81 has an annular contact surface in contact with the retainer ring 40,and the plane surface in the circumferential direction of the contact surface is 4.6. Mu. Mor less.The flatness indicates the difference between the highest position of the contactsurface and the height at the lowest position.Diagram

申请人：株式会社荏原製作所

地址：東京都大田区羽田旭町１１番１号

国籍：JP

代理人：廣澤 哲也,渡邉 勇

更多信息请下载全文后查看