专利名称：Method of manufacturing electronic
components
发明人：Sasaki, Toshiya,Uchiyama,
Kazuyoshi,Kawaguchi, Masahiko,Misaki,Katsuhiro,Matsuta, Katsuji
申请号：EP98401595.8申请日：19980626公开号：EP0887856B1公开日：20070425
摘要：A method of manufacturing an electronic component includes forming a slit (S)in a connecting electrode (2b) located on the surface of a mother substrate (1) such thatthe slit extends in a direction intersecting a cutting line (A), and cutting the mothersubstrate along the cutting line while cutting the connecting electrode having the slit.The connecting electrode is thereby reliably exposed on two opposing cut surfaces, andthe reliability of external connection of the electronic component is improved.
申请人：MURATA MANUFACTURING CO
地址：JP
国籍：JP
代理机构：Joly, Jean-Jacques
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