Bowl-shaped solder structure

专利名称：Bowl-shaped solder structure发明人：Cyprian Emeka Uzoh,Rajesh Katkar申请号：US14050193申请日：20131009

公开号：US20150097284A1公开日：20150409

专利附图：

摘要：An apparatus relating generally to a substrate is disclosed. In this apparatus, afirst metal layer is on the substrate. The first metal layer has an opening. The opening ofthe first metal layer has a bottom and one or more sides extending from the bottom. Asecond metal layer is on the first metal layer. The first metal layer and the second metal

layer provide a bowl-shaped structure. An inner surface of the bowl-shaped structure isdefined responsive to the opening of the first metal layer and the second metal layerthereon. The opening of the bowl-shaped structure is configured to receive and at leastpartially retain a bonding material during a reflow process.

申请人：Invensas Corporation

地址：San Jose CA US

国籍：US

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