SG1644/SG2644/SG3644
DUAL HIGH SPEED DRIVER
DESCRIPTION
The SG1644, 2644, 3644 is a dual non-inverting monolithic highspeed driver. This device utilizes high voltage Schottky logic toconvert TTL signals to high speed outputs up to 18V. The totempole outputs have 3A peak current capability, which enables themto drive 1000pF loads in typically less than 25ns. These speedsmake it ideal for driving power MOSFETs and other large capaci-tive loads requiring high speed switching.
In addition to the standard packages, Silicon General offers the 16pin S.O.I.C. (DW-package) for commercial and industrial applica-tions, and the Hermetic TO-66 (R-package) for military use.These packages offer improved thermal performance for applica-tions requiring high frequencies and/or high peak currents.
FEATURES
•Totem pole outputs with 3.0A peak currentcapability.
•Supply voltage to 22V.
•Rise and fall times less than 25ns.•Propagation delays less than 20ns.
•Non-inverting high-speed high-voltage Schottkylogic.
•Efficient operation at high frequency.•Available in:
8 Pin Plastic and Ceramic DIP14 Pin Ceramic DIP16 Pin Plastic S.O.I.C.20 Pin LCCTO-99TO-66
HIGH RELIABILITY FEATURES - SG1644
♦Available to MIL-STD-883♦Radiation data available
♦LMI level \"S\" processing available
EQUIVALENT CIRCUIT SCHEMATIC
VCC
6.5VVREG
2.5K3K3K
INV. INPUT
OUTPUT
LOGICGND(Substrate)
POWERGND
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SG1644/SG2644/SG3644
ABSOLUTE MAXIMUM RATINGS (Note 1)Supply Voltage (VCC) ...........................................................22VLogic Input Voltage ...............................................................7VSource/Sink Output Current (Each Output)Continuous ...................................................................±0.5APulse, 500ns ................................................................±3.0AOperating Junction TemperatureHermetic (J, T, Y, R-Packages) ....................................150°CPlastic (M, DW, L-Packages) ......................................150°CStorage Temperature Range ............................-65°C to 150°CLead Temperature (Soldering, 10 Seconds) ..................300°CNote 1. Exceeding these ratings could cause damage to the device. All voltages are with respect to ground. All currents are positive into thespecified terminal.THERMAL DATAJ Package:Thermal Resistance-Junction to Case, θJC.................. 30°C/WThermal Resistance-Junction to Ambient, θJA...............80°C/WY Package:Thermal Resistance-Junction to Case, θJC.................. 50°C/WThermal Resistance-Junction to Ambient, θJA.............130°C/WM Package:Thermal Resistance-Junction to Case, θJC.................. 60°C/WThermal Resistance-Junction to Ambient, θJA.............. 95°C/WDW Package:Thermal Resistance-Junction to Case, θJC.................. 40°C/WThermal Resistance-Junction to Ambient, θJA...............95°C/WT Package:Thermal Resistance-Junction to Case, θJC.................. 25°C/WThermal Resistance-Junction to Ambient, θJA............ 130°C/WR Package:Thermal Resistance-Junction to Case, θJC................. 5.0°C/WThermal Resistance-Junction to Ambient, θJA.............. 40°C/WL Package:Thermal Resistance-Junction to Case, θJC.................. 35°C/WThermal Resistance-Junction to Ambient, θJA............ 120°C/WNote A.Junction Temperature Calculation: TJ = TA + (PD x θJA).Note B.The above numbers for θJC are maximums for the limiting thermalresistance of the package in a standard mounting configuration.The θJA numbers are meant to be guidelines for the thermalperformance of the device/pc-board system. All of the aboveassume no ambient airflow.RECOMMENDED OPERATING CONDITIONS (Note 2)Supply Voltage (VCC) ..................................4.5V to 20V (Note 3)Frequency Range ...............................................DC to 1.5MHzPeak Pulse Current ............................................................±3ALogic Input Voltage .................................................-0.5 to 5.5VNote 2. Range over which the device is functional.Note 3. AC performance has been optimized for VCC = 8V to 20V.Operating Ambient Temperature Range (TA)SG1644 .........................................................-55°C to 125°CSG2644 ...........................................................-25°C to 85°CSG3644 ...............................................................0°C to 70°CELECTRICAL CHARACTERISTICS(Unless otherwise specified, these specfiications apply over the operating ambient temperatures for SG1644 with -55°C ≤ TA ≤ 125°C, SG2644 with -25°C≤ TA ≤ 85°C, SG3644 with 0°C ≤ TA ≤ 70°C, and VCC = 20V. Low duty cycle pulse testing techniques are used which maintains junction and casetemperatures equal to the ambient temperature.)ParameterStatic CharacteristicsLogic 1 Input VoltageLogic 0 Input VoltageInput High CurrentInput High CurrentInput Low CurrentInput Clamp VoltageOutput High Voltage (Note 4)Output Low Voltage (Note 4)Supply Current Outputs LowSupply Current Outputs HighNote 4. VCC = 10V to 20V.Test ConditionsSG1644/2644/3644UnitsMin.Typ.Max.2.0VVµAmAmAVVVmAmAVIN = 2.4VVIN = 5.5VVIN = 0VIIN = -10mAIOUT = -200mAIOUT = 200mAVIN = 0V (both inputs)VIN = 2.4V (both inputs)0.75001.0-4-1.5VCC-3187.51.027129/91 Rev 1.2 6/97
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SG1644/SG2644/SG3644
ELECTRICAL CHARACTERISTICS (continued)ParameterDynamic Characteristics (Note 6)Propagation Delay High-Low(TPHL)Propagation Delay Low-High(TPLH)Rise Time (TTLH)Fall Time (TTHL)Supply Current (ICC)(both outputs)Test Conditions (Figure 1)SG1644/2644/3644TA= 25°CTA=-55°C to 125°CSG1644UnitsMin.Typ.Max.Min.Typ.Max.CL = 1000pF (Note 5)CL = 2500pFCL = 1000pF (Note 5)CL = 2500pFCL = 1000pF (Note 5)CL = 2500pFCL = 1000pF (Note 5)CL = 2500pFCL = 2500pF, Freq. = 200KHzDuty Cycle = 50%303525303040254035405030403550305040nsnsnsnsnsnsnsnsmA2618303030Note 5. These parameters, specified at 1000pF, although guaranteed over recommended operating conditions, are not tested in production.Note 6. VCC = 15V.AC TEST CIRCUIT AND SWITCHING TIME WAVEFORMS - FIGURE 1CHARACTERISTIC CURVESFIGURE 2.TRANSITION TIMES VS. SUPPLY VOLTAGEFIGURE 3.PROPAGATION DELAY VS. SUPPLY VOLTAGEFIGURE 4.TRANSITION TIMES VS. AMBIENT TEMPERATURE9/91 Rev 1.2 6/97
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SG1644/SG2644/SG3644
CHARACTERISTIC CURVES (continued)
FIGURE 5.
PROPAGATION DELAY VS. AMBIENT TEMPERATUREFIGURE 6.
TRANSITION TIMES VS. CAPACITIVE LOADFIGURE 7.
SUPPLY CURRENT VS. CAPACITANCE LOAD
FIGURE 8.
HIGH SIDE SATURATION VS. OUTPUT CURRENTFIGURE 9.
LOW SIDE SATURATION VS. OUTPUT CURRENTFIGURE 10.
SUPPLY CURRENT VS. FREQUENCY
FIGURE 11.
SUPPLY CURRENT VS. FREQUENCY
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SG1644/SG2644/SG3644
APPLICATION INFORMATION
POWER DISSIPATION
The SG1644, while more energy-efficient than earlier gold-dopeddriver IC’s, can still dissipate considerable power because of itshigh peak current capability at high frequencies. Total powerdissipation in any specific application will be the sum of the DC orsteady-state power dissipation, and the AC dissipation caused bydriving capacitive loads.
The DC power dissipation is given by:PDC = +VCC · ICC [1]
where ICC is a function of the driver state, and hence is duty-cycledependent.
The AC power dissipation is proportional to the switching fre-quency, the load capacitance, and the square of the outputvoltage. In most applications, the driver is constantly changingstate, and the AC contribution becomes dominant when thefrequency exceeds 100-200KHz.
The SG1644 driver family is available in a variety of packages toaccommodate a wide range of operating temperatures and powerdissipation requirements. The Absolute Maximums section of thedata sheet includes two graphs to aid the designer in choosing anappropriate package for his design.
The designer should first determine the actual power dissipationof the driver by referring to the curves in the data sheet relatingoperating current to supply voltage, switching frequency, andcapacitive load. These curves were generated from data taken onactual devices. The designer can then refer to the AbsoluteMaximum Thermal Dissipation curves to choose a package type,and to determine if heat-sinking is required.DESIGN EXAMPLE
Given: Two 2500pF loads must be driven push-pull from a +15 voltsupply at 100KHz. The application is a commercial one in whichthe maximum ambient temperature is +50°C, and cost is impor-tant.
1. From Figure 11, the average driver current consumptionunder these conditions will be 18mA, and the power dissipationwill be 15volts x 18mA, or 270mW.
2. From the ambient thermal characteristic curve, it can be seenthat the M package, which is an 8-pin plastic DIP with a copperlead frame, has more than enough thermal conductance fromjunction to ambient to support operation at an ambient tempera-ture of +50°C. The SG36446M driver would be specified for thisapplication.
SUPPLY BYPASSING
Since the SG1644 can deliver peak currents above 3amps undersome load conditions, adequate supply bypassing is essential forproper operation. Two capacitors in parallel are recommended toguarantee low supply impedance over a wide bandwidth: a 0.1µFceramic disk capacitor for high frequencies, and a 4.7µF solid
9/91 Rev 1.2 6/97
Copyright © 1997
tantalum capacitor for energy storage. In military applications, aCK05 or CK06 ceramic operator with a CSR-13 tantalum capaci-tor is an effective combination. For commercial applications, anylow-inductance ceramic disk capacitor teamed with a Sprague150D or equivalent low ESR capacitor will work well. Thecapacitors must be located as close as physically possible to theVCC pin, with combined lead and pc board trace lengths held toless than 0.5 inches.
GROUNDING CONSIDERATIONS
The ability of the SG1644 to deliver high peak currents intocapacitive loads can cause undesirable negative transients onthe logic and power grounds. To avoid this, a low inductanceground path should be considered for each output to return thehigh peak currents back to it’s own ground point. A ground planeis recommended for best performance. If space for a groundplane is not available, make the paths as short and as wide aspossible. The logic ground can be returned to the supply bypasscapacitor and be connected at one point to the power grounds.LOGIC INTERFACE
The logic input of the 1644 is designed to accept standard DC-coupled 5 volt logic swings, with no speed-up capacitors required.If the input signal voltage exceeds 6 volts, the input pin must beprotected against the excessive voltage in the HIGH state. Eithera high speed blocking diode must be used, or a resistive dividerto attenuate the logic swing is necessary.LAYOUT FOR HIGH SPEED
The SG1644 can generate relatively large voltage excursionswith rise and fall times around 20-30 nanoseconds with lightcapacitive loads. A Fourier analysis of these time domain signalswill indicate strong energy components at frequencies muchhigher than the basic switching frequency. These high frequen-cies can induce ringing on an otherwise ideal pulse if sufficientinductance occurs in the signal path (either the positive signaltrace or the ground return). Overshoot on the rising edge isundesirable because the excess drive voltage could rupturethe gate oxide of a power MOSFET. Trailing edge undershoot isdangerous because the negative voltage excursion can forward-bias the parasitic PN substrate diode of the driver, potentiallycausing erratic operation or outright failure.
Ringing can be reduced or eliminated by minimizing signal pathinductance, and by using a damping resistor between the driveoutput and the capacitive load. Inductance can be reduced bykeeping trace lengths short, trace widths wide, and by using 2oz.copper if possible. The resistor value for critical damping can becalculated from:RD = 2√L/CL [2]
where L is the total signal line inductance, and CL is the loadcapacitance. Values between 10 and 100ohms are usuallysufficient. Inexpensive carbon composition resistors are bestbecause they have excellent high frequency characteristics.They should be located as close as possible to the gate terminalof the power MOSFET.
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SG1644/SG2644/SG3644
TYPICAL APPLICATIONS
FIGURE 12.
In this push pull converter circuit, the control capailities of the SG1524B PWM are combined with the powerful totem-pole driversfound in the SG1644 (see SG1626 for example). This inexpensive configuration results in very fast charge and discharge of thepower MOSFET gate capacitance for efficient switching.
FIGURE 13.
When the peak current capabilites of PWM's such as 1525A or 1526B are not sufficient to drive high capacitive loads fast enough,SG1644 is one solution to this problem. This combination is especially suited for full bridge applications where high inputcapacitance MOSFETs are being used. Diodes D1 and D2 are necessary if the leakage inductance of the drive transformer willdrive the output pins negative.
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SG1644/SG2644/SG3644
TYPICAL APPLICATIONS (continued)
FIGURE 14.
A low cost, yet powerful alternative to the single ended converters with parallel MOSFETs is a combination of SG1842 and SG1644as shown in Figure 16. This combination will also allow a low noise operation by separating the drive and its associated high peakcurrents, away from the PWM logic section.
FIGURE 15.
Fast turn off of bipolar transistors is possible by the totempose output stage of SG1644. The charge on capacitor C willdrive the base negative for faster turn off.
9/91 Rev 1.2 6/97
Copyright © 1997
FIGURE 16.
When the inputs are driven with a TTL square wave drive, thehigh peak current capabilites of SG1644 allow easy implem-entation of charge pump voltage converters.
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SG1644/SG2644/SG3644
CONNECTION DIAGRAMS & ORDERING INFORMATION (See Notes Below)
Package
14-PIN CERAMIC DIPJ - PACKAGE
Part No.SG1644J/883BSG1644J/DESCSG1644JSG2644JSG3644J
Ambient
Temperature Range-55°C to 125°C-55°C to 125°C-55°C to 125°C-25°C to 85°C0°C to 70°C
Connection Diagram
N.C.N.C.OUT APWR GND A
IN AN.C.
LOGIC GND
1234567
141312111098
VCCN.C.OUT B
PWR GND BIN BN.C.N.C.
8-PIN CERAMIC DIPY - PACKAGE
SG1644Y/883BSG1644Y/DESCSG1644YSG2644YSG3644YSG2644MSG3644MSG2644DWSG3644DW
-55°C to 125°C-55°C to 125°C-55°C to 125°C-25°C to 85°C0°C to 70°C-25°C to 85°C0°C to 70°C-25°C to 85°C0°C to 70°C
IN A
PWR GND APWR GND B
IN B
1234
8765
OUT AVCC
LOGIC GNDOUT B
8-PIN PLASTIC DIPM - PACKAGE
16-PIN WIDE BODYPLASTIC S.O.I.C.DW - PACKAGE
N.C.IN AN.C.GROUNDGROUND
N.C.
IN BN.C.
12345678
161514131211109
PWR GND AOUT AVCC
GROUNDGROUNDVCC
OUT B
PWR GND B
8-PIN TO-99 METAL CANT - PACKAGE
SG1644T/883BSG1644T/DESCSG1644TSG2644TSG3644T-55°C to 125°C-55°C to 125°C-55°C to 125°C-25°C to 85°C0°C to 70°C
VCC
OUT A
PWR GND A2
IN A
3
4
581
7
OUT B
6
PWR GND B
IN B
LOGIC GND
9-PIN TO-66 METAL CANR - PACKAGE
SG1644R/883BSG1644RSG2644RSG3644R-55°C to 125°C-55°C to 125°C-25°C to 85°C0°C to 70°C
VCC
N.C.OUT BPWR GND B
IN B
654789
132
N.C.OUT A
PWR GND AIN A
CASE IS LOGIC GROUNDNote: Case and tab areinternally connected tosubstrate ground.
(Note 4)
20-PIN CERAMIC (LCC)LEADLESS CHIP CARRIERL- PACKAGE
SG1644L/883BSG1644L/DESC-55°C to 125°C-55°C to 125°C
1.2.3.4.5.6.7.8.9.10.N.C.
PWR GND AN.C.IN AN.C.
LOGIC GNDN.C.IN BN.C.
PWR GND B
3
45678
9
212019
1817161514
10111213
11.12.13.14.15.16.17.18.19.20.N.C.N.C.OUT BN.C.VCCN.C.VCCN.C.OUT AN.C.
Note1. Contact factory for JAN and DESC product availablity.
2. All packages are viewed from the top.9/91 Rev 1.2 6/97
Copyright © 1997
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11861 Western Avenue ∞ Garden Grove, CA 92841
(714) 898-8121 ∞ FAX: (714) 893-2570
LINFINITY Microelectronics Inc.
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