3D IC CONFIGURATION WITH CONTACTLESS COMMUNICATION

专利名称：3D IC CONFIGURATION WITH

CONTACTLESS COMMUNICATION

发明人：Ping-Lin YANG,Sa-Lly LIU,Chien-Min LIN申请号：US13945169申请日：20130718

公开号：US20130302942A1公开日：20131114

专利附图：

摘要：A package comprises a die stack having at least two stacked dies coupled forcontactless communications with each other. At least one of the stacked dies has asubstrate joined to its major face. The substrate has a plurality of conductive traces in or

on the substrate for conducting power to the dies and for conducting heat from the dies.At least one conductive pillar is joined to at least one of the conductive traces on at leasta first edge of the substrate, for conducting power to the at least one die and forconducting heat from the at least one die.

申请人：Taiwan Semiconductor Manufacturing Co., Ltd.

地址：Hsin-Chu TW

国籍：TW

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